CISA KEV 정보
| 취약점명 | Qualcomm Multiple Chipsets Use-After-Free Vulnerability |
|---|---|
| 설명 | Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP. |
| 조치사항 | Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable. |
| 랜섬웨어 캠페인 악용 | Unknown |
| CWE | CWE-416 |
| 등록일 (KEV) | 2023-12-05 |
| 조치 기한 | 2023-12-26 |
| 추가 참고 | This vulnerability affects a common open-source component, third-party library, or a protocol used by different products. Please check with specific vendors for information on patching status. For more information, please see: https://git.codelinaro.org/clo/la/kernel/msm-5.15/-/commit/2643808ddbedfaabbb334741873fb2857f78188a, https://git.codelinaro.org/clo/la/kernel/msm-4.14/-/commit/d43222efda5a01c9804d74a541e3c1be9b7fe110; https://nvd.nist.gov/vuln/detail/CVE-2023-33063 |
NVD 상세 정보
CVSS v3.1: 7.8 HIGH
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H설명: Memory corruption in DSP Services during a remote call from HLOS to DSP.
CWE: CWE-416 | CWE-416
참조
- https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin [Patch, Vendor Advisory]
- https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin [Patch, Vendor Advisory]
- https://www.cisa.gov/known-exploited-vulnerabilities-catalog?field_cve=CVE-2023-33063 [US Government Resource]
This product uses the NVD API but is not endorsed or certified by the NVD.