CISA KEV 정보
| 취약점명 | Qualcomm Multiple Chipsets Use-After-Free Vulnerability |
|---|---|
| 설명 | Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services while maintaining memory maps of HLOS memory. |
| 조치사항 | Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable. |
| 랜섬웨어 캠페인 악용 | Unknown |
| CWE | CWE-416 |
| 등록일 (KEV) | 2024-10-08 |
| 조치 기한 | 2024-10-29 |
| 추가 참고 | https://git.codelinaro.org/clo/la/platform/vendor/qcom/opensource/dsp-kernel/-/commit/0e27b6c7d2bd8d0453e4465ac2ca49a8f8c440e2 ; https://nvd.nist.gov/vuln/detail/CVE-2024-43047 |
NVD 상세 정보
CVSS v3.1: 7.8 HIGH
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H설명: Memory corruption while maintaining memory maps of HLOS memory.
CWE: CWE-416 | CWE-416
참조
- https://docs.qualcomm.com/product/publicresources/securitybulletin/october-2024-bulletin.html [Patch, Vendor Advisory]
- https://www.cisa.gov/known-exploited-vulnerabilities-catalog?field_cve=CVE-2024-43047 [US Government Resource]
This product uses the NVD API but is not endorsed or certified by the NVD.